Mechanic Soldering Paste XGSP30 is a premium, lead‑free solder paste engineered for high‑precision electronic assembly. Formulated with a balanced blend of flux and ultra‑fine solder particles, XGSP30 delivers superior wetting, consistent heat transfer, and reliable joint formation for both surface‑mount technology (SMT) and through‑hole applications. Ideal for professional manufacturing lines as well as hobbyist and repair environments, this solder paste ensures clean, strong, and durable connections across a wide range of components.

Specifications:

• Composition: Flux matrix with finely ground lead‑free solder particles


• Particle Size: 15‑25 µm for optimal flow and placement


• Reflow Temperature Range: 220 °C – 250 °C


• Shelf Life: Up to 12 months when stored at 15 °C – 25 °C in a sealed container


• Viscosity: Medium‑viscous, suitable for stencil printing and manual dispensing


• Packaging: 10 g and 50 g sealed syringes


• Compliance: RoHS compliant, lead‑free (Sn‑Ag‑Cu alloy)

Typical Applications:

• Surface‑mount technology (SMT) assembly


• Reflow soldering of microchips, resistors, capacitors, and ICs


• Prototype and small‑batch PCB production


• Repair and refurbishment of electronic devices


• Hybrid assembly processes combining SMT and through‑hole components


• Educational and DIY electronics projects requiring precise solder joints